ABIS Circuits HDI PCB, 50–150 µm microvias, BGA pitch down to 0.25 mm, Any-Layer

ABIS Circuits HDI (High Density Interconnect) boards are produced with laser-drilled microvias and stacked or staggered vias. They suit fine-pitch BGA, mobile devices, 5G infrastructure and AI accelerators.

Available build-ups are 1+N+1, 2+N+2, 3+N+3 and Any-Layer HDI (ELIC), with resin-filled via-in-pad and sequential lamination. Materials include FR4, High-TG FR4, Rogers, Megtron and low-loss laminates; drilling by CO2 and UV laser.

Key features:

• Laser-drilled microvias
• Stacked/staggered microvias
• Resin-filled via-in-pad
• Sequential lamination
• Improved signal integrity

Specifications:

• Build-up types: 1+N+1, 2+N+2, 3+N+3, Any-Layer HDI (ELIC)
• Min. microvia diameter: 50–150 µm (laser drilling)
• Min. trace width: 50–75 µm (2–3 mils)
• BGA pitch: down to 0.25 mm
• Materials: FR4, High-TG FR4, Rogers, Megtron, Low-Loss
• Drilling method: CO2 + UV laser
• Microvia aspect ratio: 0.75:1 to 1:1
• Certification: ISO9001, ISO13485, IATF16949, UL, IPC-2226

Application: Smartphones, 5G infrastructure, AI processors, automotive ECUs, wearable electronics.

Before ordering: Before ordering, specify HDI build-up, BGA pitch, material, layer count and via filling requirements; provide Gerber files.