ABIS Circuits multilayer PCB, 4–20+ layers, blind/buried vias, impedance control

ABIS Circuits multilayer PCBs are high-reliability boards for compact layouts, stable signal integrity and long-term operation. Up to 20+ layers, blind and buried vias and impedance control are supported.

Boards are built to order (OEM/ODM) on FR4, High-TG FR4, Rogers, Panasonic and Isola materials with HASL, ENIG, OSP, immersion silver and immersion tin finishes. Production is certified to ISO9001, ISO13485, IATF16949, UL, IPC Class 2/3; AOI, X-ray and functional testing are applied with full process traceability.

Key features:

• Impedance control for high-speed signals
• Blind/buried vias for dense routing
• Mixed dielectric stack-ups
• Full process traceability
• AOI, X-Ray, FCT testing
• No strict MOQ, quotation from 24 hours

Specifications:

• Layer count: 4–20+
• Materials: FR4, High-TG FR4, Rogers, Panasonic, Isola
• Copper thickness: 0.5–16 oz (outer layer), 8 oz (inner layer)
• Board thickness: up to 0.250" (6.35 mm)
• Panel size: up to 21"×26"
• Min. trace width: 75–100 µm (depending on complexity)
• Surface finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin
• Certification: ISO9001, ISO13485, IATF16949, UL, IPC Class 2/3

Application: Industrial control, telecommunications, networking equipment, medical devices, automotive electronics.

Before ordering: Before ordering, specify layer count, material, copper and board thickness, surface finish, impedance requirements and IPC class; provide Gerber files.